About this scholarly article

2013 IEEE 63rd Electronic Components and Technology Conference - 3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies by Coudrain, P.; Henry, D.; Berthelot, A.; Charbonnier, J.; Verrun, S.; Franiatte, R.; Bouzaida, N.; Cibrario, G.; Calmon, F.; O'Connor, I.; Lacrevaz, T.; Fourneaud, L.; Flechet, B.; Chevrier, N.; Farcy, A.; Le-Briz, O. is a scholarly article available to read on EtoBox.

Author

Coudrain, P.; Henry, D.; Berthelot, A.; Charbonnier, J.; Verrun, S.; Franiatte, R.; Bouzaida, N.; Cibrario, G.; Calmon, F.; O'Connor, I.; Lacrevaz, T.; Fourneaud, L.; Flechet, B.; Chevrier, N.; Farcy, A.; Le-Briz, O.

Publisher

IEEE

Published

2013