About this scholarly article

2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Copper electrodeposition for 3D integration by Beica, Rozalia; Sharbono, Charles; Ritzdorf, Tom is a scholarly article available to read on EtoBox.

Author

Beica, Rozalia; Sharbono, Charles; Ritzdorf, Tom

Publisher

IEEE

Published

2008

Language

EN