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About this Engineering article
Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging by Ji, Hongjun ;Zhou, Junbo ;Liang, Meng ;Lu, Huajun ;Li, Mingyu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ji, Hongjun ;Zhou, Junbo ;Liang, Meng ;Lu, Huajun ;Li, Mingyu
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 1350-4177)
- Published
- 2018
- Language
- EN
- Field
- Engineering (Physical Sciences)
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