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About this Engineering article
Influence of Electroless Gold Plating Thickness on Wire Bondability and Ball Solderability on Tape Substrate for BGA Packages. by CHINDA, Akira; MIYAMOTO, Nobuaki; YOSHIOKA, Osamu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- CHINDA, Akira; MIYAMOTO, Nobuaki; YOSHIOKA, Osamu
- Publisher
- Japan Science and Technology Information Aggregator, Electronic; The Surface Finishing Society of Japan; Surface Financing Society of Japan/Hyomen Gijutus Kyokai (ISSN 0915-1869)
- Published
- 1998
- Field
- Engineering (Physical Sciences)
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