Opening book details…
About this Engineering article
Fast Temperature Cycling and Electromigration Induced Thin Film Cracking in Multilevel Interconnection: Experiments and Modeling by H.V. Nguyen; C. Salm; J. Vroemen; J. Voets; B. Krabbenborg; J. Bisschop; A.J. Mouthaan; F.G. Kuper is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- H.V. Nguyen; C. Salm; J. Vroemen; J. Voets; B. Krabbenborg; J. Bisschop; A.J. Mouthaan; F.G. Kuper
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 2002
- Field
- Engineering (Physical Sciences)