About this scholarly article

2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Cu concentration from backside contamination induced STI crack after High Temperature Stress by Jim Lee, ; Hsiang, J. Huang; Gunnar, Zimmermann; Alexander, Ambatiello; Xu, X. Wang; Tim, J. Pifer is a scholarly article available to read on EtoBox.

Author

Jim Lee, ; Hsiang, J. Huang; Gunnar, Zimmermann; Alexander, Ambatiello; Xu, X. Wang; Tim, J. Pifer

Publisher

IEEE

Published

2015