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About this Engineering article
Crack Detection and Analyses Using Resonance Ultrasonic Vibrations in Full-Size Crystalline Silicon Wafers by Belyaev, A.E.; Polupan, O.; Dallas, W.; Ostapenko, Sergei S.; Hess, D.; Wohlgemuth, John is a Engineering article available to read on EtoBox.
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- Author
- Belyaev, A.E.; Polupan, O.; Dallas, W.; Ostapenko, Sergei S.; Hess, D.; Wohlgemuth, John
- Publisher
- Trans Tech Publications, Ltd.; Scientific.net; Scitec Publications Ltd. (ISSN 1662-9779)
- Published
- 2005
- Field
- Engineering (Physical Sciences)