Skip to content

Opening book details…

About this Engineering article

Experimental Study of Thermal Plasma Processing Waste Circuit Boards by Wang, Song Bai; Cheng, Chang Ming; Lan, Wei; Zhang, Xian Hui; Liu, Dong Ping; Yang, Si Ze is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Wang, Song Bai; Cheng, Chang Ming; Lan, Wei; Zhang, Xian Hui; Liu, Dong Ping; Yang, Si Ze
Publisher
Trans Tech Publications, Ltd.; Trans Tech Publications (ISSN 1662-8958)
Published
2013
Field
Engineering (Physical Sciences)

More by Wang, Song Bai; Cheng, Chang Ming; Lan, Wei; Zhang, Xian Hui; Liu, Dong Ping; Yang, Si Ze

Browse all works by Wang, Song Bai; Cheng, Chang Ming; Lan, Wei; Zhang, Xian Hui; Liu, Dong Ping; Yang, Si Ze