About this Engineering article
The Kinetics of Electromigration Damage in Copper Films Studied by Isothermal Resistance Change Analysis by Park, C. W.; Vook, R. W. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Park, C. W.; Vook, R. W.
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP) (ISSN 0272-9172)
- Published
- 1991
- Language
- EN
- Field
- Engineering (Physical Sciences)