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About this Engineering article
TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC by Jung, M.; Mitra, J.; Pan, D. Z.; Lim, S. K. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jung, M.; Mitra, J.; Pan, D. Z.; Lim, S. K.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0278-0070)
- Published
- 2012
- Field
- Engineering (Physical Sciences)
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