About this scholarly article

2008 9th International Conference on Solid-State and Integrated-Circuit Technology - Microfabrication of Through Silicon Vias (TSV) for 3D SiP by Hongguang Liao, ; Min Miao, ; Xin Wan, ; Yufeng Jin, ; Liwei Zhao, ; Bohan Li, ; Yuhui Zhu, ; Xin Sun, is a scholarly article available to read on EtoBox.

Author

Hongguang Liao, ; Min Miao, ; Xin Wan, ; Yufeng Jin, ; Liwei Zhao, ; Bohan Li, ; Yuhui Zhu, ; Xin Sun,

Publisher

IEEE

Published

2008

Language

EN