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Ag-Cu Thin Film: Deposition Time Effects by mkozin is a document available to read on EtoBox.
The document discusses the effect of deposition time on the properties of Ag-Cu thin films created using physical vapor deposition sputtering. It analyzed films deposited for 10, 15, and 20 minutes. Scanning electron microscopy images showed incomplete films with 10 minutes deposition but complete films with longer times. Atomic force microscopy found the lowest surface roughness with 15 minutes deposition. Rockwell indentation testing showed the adhesion was weak for all deposition times. Kirby-Bauer testi
- Author
- mkozin
- Language
- EN