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Reliability Assessment of Flip-Chip Assemblies With Lead-Free Solder Joints by MarceloMi is a document available to read on EtoBox.
What is Reliability Assessment of Flip-Chip Assemblies With Lead-Free Solder Joints about?
The document discusses reliability assessments of flip-chip assemblies using lead-free solder joints. It examines the mechanical and physical properties of different solder alloys, as well as their microstructural appearance. Thermal cycling tests are also performed on flip-chip assemblies using different solder bumps and underfill materials to study deterioration over time.
- Author
- MarceloMi
- Language
- EN