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About this Engineering article
Evaluation of Interfacial Adhesion between Si Substrate and Organic Polymer Dielectric Film by Yamazaki, Hirofumi; Enoki, Manabu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yamazaki, Hirofumi; Enoki, Manabu
- Publisher
- Japan Institute of Metals; The Japan Institute of Metals; Nippon Kinzoku Gakkai; Sendai: Nihon Kinzoku Gakkai (ISSN 0021-4876)
- Published
- 2004
- Field
- Engineering (Physical Sciences)