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About this Materials Science article
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints by Chen, Chih; Tong, H.M.; Tu, K.N. is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Chen, Chih; Tong, H.M.; Tu, K.N.
- Publisher
- Annual Reviews; Annual Reviews Inc. (ISSN 1531-7331)
- Published
- 2010
- Language
- EN
- Field
- Materials Science (Physical Sciences)