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About this Engineering article
A quantitative investigation of the influence with the components of the CMP alkali slurry on the polishing rate by Fan, Shiyan; Liu, Enhai; Zhang, Jun; Liu, Yuling; Wang, Lei; Lin, Kai; Sun, Ming; Shi, Lukui is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Fan, Shiyan; Liu, Enhai; Zhang, Jun; Liu, Yuling; Wang, Lei; Lin, Kai; Sun, Ming; Shi, Lukui
- Publisher
- IOP Publishing; Institute of Physics Publishing (ISSN 1674-4926)
- Published
- 2015
- Language
- EN
- Field
- Engineering (Physical Sciences)