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1) IC packages deliver power to chips, transfer signals in and out, dissipate heat, and protect chips. Common package types include lead frame, BGA, CSP, and SiP. 2) Die can be attached via wire bonding, tape automated bonding (TAB), flip-chip bonding, or direct connection. Flip-chip offers advantages like shorter interconnects and higher density. 3) Emerging trends include 3D packaging using stacked die, build-up substrates, flip-chip, and system-in-package (SiP) using substrates like LTCC.

Author

albertsdeguzman

Language

EN