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About this Engineering article
Fabrication and electrical characteristics of a novel interposer with polymer liner and silicon pillars with ultra-low-resistivity as through-silicon-vias (TSVs) for 2.5D/3D applications by Chen, Qian-Wen; Yan, Yang-Yang; Ding, Ying-Tao; Wang, Shi-Wei; Wang, Wei-Jiang is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Chen, Qian-Wen; Yan, Yang-Yang; Ding, Ying-Tao; Wang, Shi-Wei; Wang, Wei-Jiang
- Publisher
- Springer-Verlag; Springer Verlag; Springer Science and Business Media LLC (ISSN 0946-7076)
- Published
- 2014
- Field
- Engineering (Physical Sciences)
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