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This article discusses the use of picosecond ultrashort pulse lasers for microdrilling through-holes in flexible printed circuits (FPCs), highlighting the need for high-density and high-quality interconnects in miniaturized electronic products. The study systematically investigates the effects of various laser parameters on the drilling process, achieving through-holes with diameters less than 10 µm and interconnection pitches of 0~2 µm. The findings demonstrate the feasibility of this method for practical

Author

張弘旻

Language

EN