About this scholarly article

2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Multi-chip plastic package technology with new substrate by Zhang, Rongzhen; Zhu, Yuan; Liao, Xiaoping; Gao, Nayan is a scholarly article available to read on EtoBox.

Author

Zhang, Rongzhen; Zhu, Yuan; Liao, Xiaoping; Gao, Nayan

Publisher

IEEE

Published

2017