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Electromechanical Impedance in SHM by Yago Monteiro is a document available to read on EtoBox.

The document presents a literature review of using electromechanical impedance spectroscopy for structural health monitoring, particularly of adhesively bonded joints. It discusses the theoretical background, algorithms for damage detection and quantification, and applications to monitoring adhesive joints. While advances have been made, the technology is not yet mature for real-world applications.

Author
Yago Monteiro
Language
EN