About this scholarly article

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - High reliability encapsulant liquid resin for SIP by Nagai, Koichiro; Ishikawa, Yuki; Okuno, Atsushi is a scholarly article available to read on EtoBox.

Author

Nagai, Koichiro; Ishikawa, Yuki; Okuno, Atsushi

Publisher

IEEE

Published

2009

Language

EN