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This paper reviews the advancements in signal integrity (SI) and electromagnetic compatibility (EMC) design technologies for PCBs, highlighting the importance of accurate modeling and analysis to meet the demands of high-speed data transmission. It discusses the impact of parameter variability, the necessity of practical training for designers, and the contributions of Prof. C. Paul to the field. The paper also covers various methods for addressing issues like crosstalk, differential signaling, and common-m

Author

710629071

Language

EN