About this scholarly article

2009 International Conference on Electronic Packaging Technology & High Density Packaging - Solder joints reliability with different Cu plating current density in Wafer Level Chip Scale Packaging (WLCSP) by Cao, Kenny; Tan, Kh; Lai, Cm; Zhang, Li is a scholarly article available to read on EtoBox.

Author

Cao, Kenny; Tan, Kh; Lai, Cm; Zhang, Li

Publisher

IEEE

Published

2009

Language

EN