About this scholarly article

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Simulation for power integrity to design a PCB for an optimum cost by Fizesan, Raul; Pitica, Dan is a scholarly article available to read on EtoBox.

Author

Fizesan, Raul; Pitica, Dan

Publisher

IEEE

Published

2010

Language

EN