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This article discusses the development of high-bandwidth interchip interconnects, specifically focusing on low-swing differential electrical interconnects and optical interconnects, to address the limitations of traditional parallel interconnects in terms of bandwidth and latency. The authors present models for analyzing these interconnects based on crosstalk noise, attenuation, and receiver sensitivities, demonstrating that optical interconnects can significantly enhance chip pin performance while reducing

Author

wedoso6101

Language

EN