About this scholarly article

2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Influence of observed anelasticity of Cu on the wafer warpage evolution during thermal processes by Cheng, Gong; Xu, Gaowei; Gai, Wei; Luo, Le is a scholarly article available to read on EtoBox.

Author

Cheng, Gong; Xu, Gaowei; Gai, Wei; Luo, Le

Publisher

IEEE

Published

2018

Language

EN