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About this Engineering article
Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors by Fumihiro Inoue; Mitsumasa Koyanagi; Takafumi Fukushima; Kazuhiro Yamamoto; Hideyosi Tanaka; Zenglin Wang; Shoso Shingubara is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Fumihiro Inoue; Mitsumasa Koyanagi; Takafumi Fukushima; Kazuhiro Yamamoto; Hideyosi Tanaka; Zenglin Wang; Shoso Shingubara
- Publisher
- The Electrochemical Society (ISSN 2151-2043)
- Published
- 2008
- Language
- EN
- Field
- Engineering (Physical Sciences)