About this Engineering article
Method for Producing Via-connections in Semiconductor Wafers Using a Combination of Plasma and Chemical Etching by Guldan, A.; Hrubcin, L.; Kubek, J.; Tykva, R. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Guldan, A.; Hrubcin, L.; Kubek, J.; Tykva, R.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0018-9383)
- Published
- 1983
- Field
- Engineering (Physical Sciences)