About this scholarly article

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - Through-silicon via (TSV) depletion effect by Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo is a scholarly article available to read on EtoBox.

Author

Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo

Publisher

IEEE

Published

2011

Language

EN