About this scholarly article

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Moisture-Induced Die Stresses in PBGA Packages Exposed to Various Environments by Chen, Jun; Nguyen, Quang; Roberts, Jordan C.; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep is a scholarly article available to read on EtoBox.

Author

Chen, Jun; Nguyen, Quang; Roberts, Jordan C.; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep

Publisher

IEEE

Published

2018