About this scholarly article

OFC 2001. Optical Fiber Communication Conference and Exhibit. Technical Digest Postconference Edition (IEEE Cat. 01CH37171) - High-speed electroabsorption (EA) modulator modules using the flip-chip bonding (FCB) technique by Miyahara, T.; Kaneko, S.; Noda, M.; Ishizaki, M.; Kitamura, Y.; Takagi, K.; Tada, H.; Hatta, T.; Kasahara, K. is a scholarly article available to read on EtoBox.

Author

Miyahara, T.; Kaneko, S.; Noda, M.; Ishizaki, M.; Kitamura, Y.; Takagi, K.; Tada, H.; Hatta, T.; Kasahara, K.

Publisher

Opt. Soc. America

Published

2001

Language

EN