About this scholarly article

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) - Mechanical reliability effects of back-grinding upon GaAs LSI chips by Nishiguchi, M.; Goto, N.; Nishizawa, H. is a scholarly article available to read on EtoBox.

Author

Nishiguchi, M.; Goto, N.; Nishizawa, H.

Publisher

IEEE

Published

1993