About this scholarly article

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Low temperature Cu-Cu direct bonding using formic acid vapor pretreatment by Yang, Wenhua; Shintani, Hiroyuki; Akaike, Masatake; Suga, Tadatomo is a scholarly article available to read on EtoBox.

Author

Yang, Wenhua; Shintani, Hiroyuki; Akaike, Masatake; Suga, Tadatomo

Publisher

IEEE

Published

2011