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About this book
玉米种子脱粒损伤机理与脱粒设备研究 by 高连兴,李心平著 is a book available to read on EtoBox.
- Author
- 高连兴,李心平著
- Publisher
- 北京:北京师范大学出版社
- Published
- 2012
- Language
- ZH
- ISBN
- 9787303141197
- Updated
- 2026-03-25
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Published by 北京:北京师范大学出版社 (2012).
Details
- Publisher
- 北京:北京师范大学出版社
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Quick info
- Language
- Chinese
- Published
- 2012
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