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Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration by Chuanjun Nie; Qinzhi Xu; Chenghan Wang; He Cao; Jianyun Liu; Zhiqiang Li is a Engineering article available to read on EtoBox.

What is Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration about?

Thermal issue has significant effect on the reliability and performance of integrated circuits with the increase of integrated density, especially for 2.5-D and 3-D heterogeneous integration packaging systems. In this paper, a new highly efficient 3-D transient thermal distribution model has been constructed to capture the heat conduction behavior of multiple heat sources for chiplet heterogeneous integration (CHI) by improving the alternating direction implicit finite difference method (ADI-FDM). Firstly, a new floating optimization algorithm (FOA) of coefficient matrix assignment of heat conduction equation and a new boundary treatment utilizing virtual points are proposed to modify the ADI-FDM and improve the model efficiency of thermal analysis. Furthermore, a universal equivalent thermal conductivity model is also built up to describe the design features of through silicon via (TSV), bump and redistribution layer structures, which can enhance the flexibility of FDM-based thermal simulator. Compared with previous finite element analysis results, the present FOA-accelerated thermal model can not only obtain an accurate simulation result of temperature profile, but also give a si

Who reads Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration?

Author

Chuanjun Nie; Qinzhi Xu; Chenghan Wang; He Cao; Jianyun Liu; Zhiqiang Li

Publisher

Elsevier BV

Published

2023

Language

EN

Field

Engineering (Physical Sciences)