About this scholarly article

2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Cu-Cu direct bonding technology using ultrasonic vibration for flip-chip interconnection by Arai, Yoshiyuki; Nimura, Masatsugu; Tomokage, Hajime is a scholarly article available to read on EtoBox.

Author

Arai, Yoshiyuki; Nimura, Masatsugu; Tomokage, Hajime

Publisher

IEEE

Published

2015