About this scholarly article

SPIE Proceedings [SPIE The International Conference on Micro- and Nano-Electronics 2014 - Zvenigorod, Russian Federation (Monday 6 October 2014)] International Conference on Micro- and Nano-Electronics 2014 - Approaches to a dies decoupling during failure analysis of the 3D package integrated circuits by Orlikovsky, Alexander A.; Molodtsova, G.; Milovanov, R.; Zubov, D.; Kelm, E. is a scholarly article available to read on EtoBox.

Author

Orlikovsky, Alexander A.; Molodtsova, G.; Milovanov, R.; Zubov, D.; Kelm, E.

Publisher

SPIE

Published

2014