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About this Engineering article
The influence of temperature and dielectric materials on stress induced voiding in Cu dual damascene interconnects by Zhenghao Gan; Wei Shao; S.G. Mhaisalkar; Zhong Chen; Hongyu Li is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Zhenghao Gan; Wei Shao; S.G. Mhaisalkar; Zhong Chen; Hongyu Li
- Publisher
- Elsevier Science; Elsevier ; Elsevier Sequoia; Elsevier BV (ISSN 0040-6090)
- Published
- 2006
- Language
- EN
- Field
- Engineering (Physical Sciences)
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