About this scholarly article

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components by Shouk, ; Mohanty, Rita; Xiaodong Jiang, ; Runsheng Mao, ; Jeffery ChangBing Lee, ; Chuan Xia, ; Sweatman, Keith; Desmond Teoh, is a scholarly article available to read on EtoBox.

Author

Shouk, ; Mohanty, Rita; Xiaodong Jiang, ; Runsheng Mao, ; Jeffery ChangBing Lee, ; Chuan Xia, ; Sweatman, Keith; Desmond Teoh,

Publisher

IEEE

Published

2009

Language

EN