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About this Materials Science article
The shearing behavior and microstructure of Sn–4Ag–0.5Cu solder joints on a Ni–P–carbon nanotubes composite coating by X. Gu; Y.C. Chan; D. Yang; B.Y. Wu is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- X. Gu; Y.C. Chan; D. Yang; B.Y. Wu
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2009
- Field
- Materials Science (Physical Sciences)