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The document discusses the major processing steps for fabricating BJT and MOSFET transistors. It describes techniques like oxidation, lithography, doping, epitaxy and metallization. Key steps for BJT include growing an epitaxial layer, implementing a buried layer through implantation, diffusing regions for the base, emitter and collector. Major MOSFET steps involve growing gate oxide, patterning for the gate, and doping the source and drain.
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- EN