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About this Engineering article
Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure by Ouyang, Fan-Yi; Hong, Gong-Lin; Hsu, Yuan-Ruei; Mao, Shan-Yu; Liu, Wei-Jun is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ouyang, Fan-Yi; Hong, Gong-Lin; Hsu, Yuan-Ruei; Mao, Shan-Yu; Liu, Wei-Jun
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 2019
- Language
- EN
- Field
- Engineering (Physical Sciences)
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