About this scholarly article

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Copper direct bonding: An innovative 3D interconnect by Gueguen, Pierric; Di Cioccio, Lea; Morfouli, Panagiota; Zussy, Marc; Dechamp, Jerome; Bally, Laurent; Clavelier, Laurent is a scholarly article available to read on EtoBox.

Author

Gueguen, Pierric; Di Cioccio, Lea; Morfouli, Panagiota; Zussy, Marc; Dechamp, Jerome; Bally, Laurent; Clavelier, Laurent

Publisher

IEEE

Published

2010

Language

EN