About this scholarly article

Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Temperature cycle-induced die metal shearing in surface mount devices after infra red/vapour phase reflow by Kumar, S.; Goh Jing Sua, ; Wai, D.L.T. is a scholarly article available to read on EtoBox.

Author

Kumar, S.; Goh Jing Sua, ; Wai, D.L.T.

Publisher

IEEE

Published

1995