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About this Engineering article
Nondestructive Detection of Microvoids at the Interface of Direct Bonded Silicon Wafers by Scanning Infrared Microscopy by Khánh, N. Q is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Khánh, N. Q
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 1995
- Language
- EN
- Field
- Engineering (Physical Sciences)