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Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - Flow characterization and thermo-mechanical response for anisotropic conductive films by Dudek, R.; Schubert, A.; Meinel, S.; Michel, B.; Dorfmuller, L.; Knoll, P.M.; Baumbach, J. is a scholarly article available to read on EtoBox.

Author
Dudek, R.; Schubert, A.; Meinel, S.; Michel, B.; Dorfmuller, L.; Knoll, P.M.; Baumbach, J.
Publisher
IEEE
Published
1998
Language
EN

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