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Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate by S.K. Ghosh; P.K. Limaye; B.P. Swain; N.L. Soni; R.G. Agrawal; R.O. Dusane; A.K. Grover is a Engineering article available to read on EtoBox.
What is Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate about?
In the present study, [Ni (4.5 nm)/Cu (t Cu = 2, 4 and 8 nm)] multilayers were pulse electrodeposited on stainless steel (AISI SS 304) substrate from sulphate based single bath technique. X-ray diffraction (XRD) was used to investigate the structure and stress of the Ni/Cu multilayer. The results from XRD analysis indicated that the deposited multilayers had a preferred crystal orientation of [111] and presence of satellite reflection suggested the formation of superlattice. The stress level within the deposited multilayers was found to be sensitive to the sublayer thickness. Sliding wear behaviour of electrodeposited Ni/Cu multilayer films has been investigated against a tungsten carbide (WC) ball as the counter body and compared with that of the constituents, Cu and Ni coatings. The wear tests were carried out by using a reciprocating ball-on-flat geometry at translation frequencies of 5 and 10 Hz, slip amplitude of 1 mm and at five different loads of 3, 5, 7, 9 and 11 N. Friction force was recorded on-line during the tests. At the end of the tests, the wear scars were examined by laser surface profilometry and scanning electron microscopy (SEM). Friction coefficient was found to
Who reads Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- S.K. Ghosh; P.K. Limaye; B.P. Swain; N.L. Soni; R.G. Agrawal; R.O. Dusane; A.K. Grover
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0257-8972)
- Published
- 2007
- Language
- EN
- Field
- Engineering (Physical Sciences)