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About this Engineering article
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint by Wei-Yu Chen; Tsung-Chieh Chiu; Kwang-Lung Lin; Yi-Shao Lai is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Wei-Yu Chen; Tsung-Chieh Chiu; Kwang-Lung Lin; Yi-Shao Lai
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0966-9795)
- Published
- 2012
- Field
- Engineering (Physical Sciences)
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