Can I read Reflow soldering processes and troubleshooting : SMT, BGA, CSP, and flip chip technologies on EtoBox?

Reflow soldering processes and troubleshooting : SMT, BGA, CSP, and flip chip technologies by Ning-Cheng Lee is a nonfiction available to read on EtoBox.

What is Reflow soldering processes and troubleshooting : SMT, BGA, CSP, and flip chip technologies about?

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the ma

Who reads Reflow soldering processes and troubleshooting : SMT, BGA, CSP, and flip chip technologies?

Author

Ning-Cheng Lee

Publisher

Elsevier Science & Technology Books

Published

2001

Language

EN

ISBN

9780750672184

Category

nonfiction

Subjects

Engineering, Stem